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CPU Package Reference.
Below are all the major packages used in CPUs and MCUs. Most all other packages
are merely variations of the below types, adding such things as heat spreaders,
or different pitches. Modern chips are leaning towards CSP (Chip Scale Package)
as it allows the package to be almost as small as the die it contains. This
allows smaller packages and a reduction in heat buildup.
| Package | Sample |
Typical Pin Counts | Used by | Notes |
| CDIP (Ceramic Dual Inline Package) |
 |
24, 28, 32, 36, 40, 42, 48. 64 | 4040 808x 80187 8028x 6502 6800 8x51 etc |
May be gold or tin leads |
| CerDIP (Glass sealed Ceramic DIP |
 |
24, 28, 32, 36, 40, 42, 48, 64 | 4040 808x 80187 8028x 6502 6800 8x51 etc |
Glass sealed, no cap |
| PDIP (Plastic DIP) |
 |
24, 28, 32, 36, 40, 42, 48, 64 | 4040 808x 80187 8028x 6502 68000 8x51 etc |
|
| SDIP (Skinny DIP) |
 |
8, 16, 18, 20, 24, 28 | 4004 8008 PICs |
May be Ceramic or Plastic |
| SDIP (Shrink DIP) |
 |
30, 42, 64 | Z180 | Smaller lead pitch |
| QIP (Quad Inline Package) |
 |
42, 64 | 12660 6511 |
Very uncommon, very fragile |
| CLCC (Ceramic Leadless Chip Carrier) |
 |
68 | 8018x 80286 68000 |
Very durable, used in many apps where space was an issue |
| PLCC (Plastic LCC) |
 |
18, 20, 22, 28, 32, 44, 68, 84 | 808x 8018x 8028x 68000 6502 |
|
| QFP (Quad Flat Pack) |
 |
44, 56, 64, 80, 100, 128, 160, 208, 240, 272, 304 | 8038x |
Note 4 corners for machine placement |
| PQFP (Plastic QFP) |
 |
44, 56, 64, 80, 100, 128, 160, 208, 240, 272, 304 | 80186 Z180 |
4 corner 'knobs' deleted. |
| CQFP (Ceramic QFP) |
 |
44, 56, 64, 80, 100, 128, 160, 208, 240, 272, 304 | 680x0 | Ceramic package, used only by Motorola |
| TQFP (Thin QFP) |
 |
44, 56, 64, 80, 100, 128, 160, 208, 240, 272, 304 | PowerPC | Thinner package |
| PGA (Pin Grid Array) |
 |
Many | 80x86 680x0 Many Others |
May be Plastic, Ceramic with standard, staggered or micro style pins. |
| BGA (Ball Grid Array) |
 |
Many | VIA C3 Rise Mobile CPUs |
Used for most integrated apps. VERY dense pinout (chipsets, GPUs, CPUs) May have an embedded heat slug. |
| SOP (Small Outline Package) |
 |
24, 28, 32, 40, 44 | Many MCUs | Used for MCUs in embedded apps. |
If you have additional packages that have been used for CPUs please let me know.