Motorola MC68040VL

A month or so ago a friend was opening up a bunch of unmarked packages, and taking die photos and came across an interesting Motorola.  The die looked familiar, but at the same time different.  The die was marked 68040VL, and appeared to be smaller version of the 68040V.  The Motorola 68040V is a 3.3V static design of the Motorola MC68LC040 (It has dual MMUs but lacks the FPU of the 68040).  The 68040V was made on a 0.5u process and introduced in 1995.  Looking closely at the mask revealed the answer, in the form of 4 characters. F94E

Motorola Mask F94E – COLDFIRE 5102

Motorola uses mask codes for nearly all of their products, in many ways these are similar to Intel’s sspecs, but they are more closely related to actual silicon mask changes in the device.  Multiple devices may use the same mask/mask code just with different features enabled/disabled.  The Mask code F94E is that of the first generation Motorola COLDFIRE CPU, the MCF5102.  The COLDFIRE was the replacement for the Motorola 68k line, it was designed to be a 32-bit VL-RISC processor, thus the name 68040VL for VL-RISC. .  VL-RISC architectures support fixed length instruction (like a typical RISC) but also support variable length instructions like a traditional CISC processor.  This allows a lot more code flexibility and higher code density.  While this may be heresy to RISC purists it has become rather common.  The ST Transputer based ST20 core is a VL-RISC design, as is the more modern RISC-V architecture.  The COLDFIRE 5102 also had another trick, or treat up its sleeve.  It could execute 68040 code.

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Chip Supply Inc. CS603RMP-200 – 2005 Production Miltemp PowerPC 603r

The original PowerPC 603 was released way back in 1994, made on a 0.5u process and running at 75MHz.  A year later, the greatly improved PowerPC 603e was released, made on the same process, but supporting speeds of up to 200MHz.  It doubled the L1 caches to 16K each (for Instruction and Data) and introduced some Power Down modes useful for mobile and other low power applications.  A die shrink to 0.5u allowed speeds of up to 300MHz.

The 603e was available in both BGA  and cerquad packages, which worked for most applications.  But what if you wanted something a bit different?  What if your application needed something a bit more robust.  This is where packaging and die specialist companies come into play.  Motorola/IBM had no desire to make short runs of oddball packages and/or dies screened for higher end use.  Other companies however, did…

Motorola MPC603ERX100LN – 2000 vintage PowerPC 603e

Chip Supply Inc. was founded back in 1978 in Orlando, FL  just for this purpose.  Chip Supply provided die testing and packaging services for many different companies.  They also provided a service known as ‘die banking’ and just as the name implies, this involves collection and storing wafers and/or dies for future use.  This helped with end-of-life products especially.  As manufacturers slowed, changed, or stopped production of a device, dies for it could be made available through firms like Chip Supply.

In 1997 Chip Supply Inc. signed an agreement with Motorola giving them access to bare dies and known good dies for the PowerPC 603e, MPC106/7 PCI Bridge, and the MC68000 line.  This allowed Chip Supply to source dies from Motorola, screen them for higher spec (Military and Industrial temp typically).  Motorola had a similar agreement with Thomson-CSF (later this line was acquired by Atmel) who did the same thing, but also made radiation tested parts for space use (notably used on the original Iridium satellite constellation).

16×16 PGA in a 50mm package. Pins are 6mm long (twice as long as a Socket 7 Pentium)

The CS603RMP-200 is a 200MHz PowerPC 603r processor.  The 603r is nearly identical to the 603e, but allows for lower voltages (2.5V) and is made on a 0.29u process.  Chip Supply packaged this in a 16×16 CPGA package that is 50mmx50mm (nearly 2 inches square). It includes a large, gold plated heatspreader thats about the same size as a typical BGA PowerPC 603e.  These use original Motorola dies, upcreened to Military temperature (-55-125C) and tested to run at 200MHz.  The large heatspreader and ceramic package allow for better thermal management, and better mechanical support.  Thermal cycling and vibrations often result in BGA connection failures (a familiar problem on some game consoles in the early 2000’s), something a properly mounted PGA chip is much more tolerant of.

Chip Supply Inc. was acquired by Micross Components in 2010, a company that formed in 1998, and provided the same services with the addition of radiation testing. It appears that this was the end of the line for the entire PowerPC line by Chip Supply, though its likely that custom orders could be fulfilled for sometime after the acquisition.   Someday perhaps we’ll find out what applications the PGA PowerPC 603s were used in.

Motorola XSP56001ZL20 – 20.5MHz 1990

In 1985 Motorola was looking to create a DSP (Digital Signal Processor) line of processors to go with their very popular 68000 series of general purpose processors.  DSP’s are similar to a normal processor but, as their name implies, are designed to work on signals, versus data stored in memory.  Typical signal data is audio, video, RF (such as RADAR information) and anything else that comes in via an ADC.  These signals are processed via algorithm such as FFTs (Fast Fourier Transforms) to manipulate, change or analyse them.  In audio, this can be used for cleaning up an audio stream, adding effects to it, or even generating audio.

In the 1980’s the main single chip DSP competitors was the still in use TI TMS320 series. the ATT/WE DSP16 series, and some DSP’s from OKI/NEC.  When Motorola began work on what would become the DSP56000 they asked one of their long time customers, Peavey, what they would like to see in a DSP. Peavey is an audio equipment manufacturer, making such things as guitar amps and keyboards, so would have a good idea of what would be useful in a DSP designed for audio signals.

These were packaged in a ‘SLAM’ package. The contacts/traces were easily damaged by leaking batteries.

The DSP5600 is a 24-bit processor made on a 1.5u HCMOS process with around 150,000 transistors.  24-bits were selected as that was ideal for audio sampling at the time (and most ADS/DACs at the time max’d out at 20-bits of resolution anyways.  These DSP’s had a 3-stage pipeline and ran at 20.5MHz, 27MHz and 33MHz.  This provided around 10.25 MIPS of performance (at 20.5MHz).  They were a fixed point (no floating point support in hardware) design, which was adequate at the time.  A total of 62-instructions were provided.

The DSP56001 is identical to the DSP56000 except that it has 512×24-bits of on-chip program
RAM instead of 3.75K of program ROM and a 32×24-bit bootstrap ROM for loading the program RAM.  This is the version that became most popular.  Peavey used the 560001 (3 of them actually) to power the DPM3 SE keyboard back in 1990.  Recently J. Acorn, from Crasno Electronics in Canada sent The CPU Shack Museum an e-mail inquiring if I had a few of these now obsolete 56001 DSPs spare, to rebuild some dead Peavey keyboards.   As a Museum, I not only like to collect and present vintage IC’s but also regularly help people with project such as this, and have thousands of CPU’s sitting around that have been acquired through the years (really its a bit crazy how much I have collected lol).  Mr. Acorn needed 2 of these DSPs to replace ones destroyed by a leaking battery in a keyboard, and two is exactly what I had spare.  I dug them out, packaged them, and off to Canada they went.  The result?  A restored and working Peavey keyboard.  You can read about the restoration process on Crasno’s site.

The 56000 series continued to be made by Motorola (and then Freescale) up until 2012 when it was announced it would be discontinued as a standalone product.  The 56000 series cores though live on, inside of other Freescale (now NXP) products.

AMD K6-2 Marketing Sample

During the development of most any given processor many chips are produced before it is released for commercial use.  These pre-production chips serve a wide variety of purposes in the design and debugging of the processor to ensure that the final CPU work well, sells well, and is compatible with all the vendors parts (motherboards, cooling solutions, power supplies, etc).  These chips are generally referred to as samples, and there is several types of them.  We’ll use Intel/AMD as the main examples but most all processor companies work in similar ways.

When a processor design is first being developed, the package for it is also often being developed as well, what will the new processors silicon die reside in?  How many pins? How will it dissipate heat?  This type of testing is often handled with Mechanical Samples.  Mechanical Samples are exactly as they sound, they test the mechanical aspects of the processor, the physical fit of it.  THese are often sent to board/socket manufacturers to ensure the processor will fit in sockets/boards, and with the automated equipment used to build systems.  Cooling solution companies may also receive these to test how a heatsink fits on the CPU. Mechanical samples may not contain a die at all, or may be chips that were tested as bad, or simply just untested chips (Intel used a lot of untested Mechanical Samples in their educational kits).

Thermal Sample for the LGA2011 Sandy Bridge Xeon

The next samples typically made are Electrical/Thermal Samples.  These again do not have an actually processor die in them, but electrically do work.  Electrical/Thermal samples are used to test the power draw and heat dissipation of a processor.  They often use a daisy chain transistor design, which serves to draw/dissipate power.  If a processor is expected to dissipate 135W of heat, a Thermal sample can be made to draw/dissipate exactly that.  These can test the the power supplies on motherboards, as well as the heat dissipation abilities of cooling solutions.  Some Thermal Samples have a temperature sensor added directly to the package to help see what temps they achieve.  Electrical Samples and Thermal Samples could also be used as purely Mechanical Samples too, and this is sometimes seen marked on the sample.

The first samples made that actually contain a functioning processor die are Engineering Samples.  Engineering Samples (also known as ES) are the most well known samples.  Overclockers often like to find ES CPUs as they will often allow for easier overclocking due to some not having locked in speed (multiplier locked).  Engineering Sample CPUs themselves come in several types as well.  Usually the first run is known as ES1, these can be thought of as an ‘Alpha’ version.  They are very likely to be buggy, and rarely run at the same speed as a production chip would.  These exist to test the overall processor design, or some subset of it.  Some are made to test just one part of the CPU, for example , the memory controller, or the cache.  Later versions of

Motorola PowerPC 8260 Engineering Sample (note the PPC prefix)

Engineering Samples are often called ‘ES2.’ These processors are getting closer to final production and are a lot less buggy, these would be considered ‘Beta’ Samples.  Most of the time these are quite usable chips, and often are very similar in clock speed/features to a production processor.   Intel denoted these chips with a Q-spec (such as QBGC) rather then production processor having an S-spec (such as SL5G8).  AMD typically uses part numbers starting with ‘1’ for ES1 CPUs and ‘2’ for ES2 CPUs. (such as Opterons 1S160805L4BGC or 2S16….).  Other companies have similar methodologies.  Motorola (Freescale) used the PPC prefix for most ES CPUs and Texas Instruments uses ‘TMP’ (not to be confused with Toshiba who also uses the TMP pre-fix, but for processors in general). Once a company is fairly confident a design is ready for release one final version is made.

These are known as Qualification Samples (QS).  QS processors almost always have a one to one equivalence with a production part, since that is their purpose, to make sure the design is ready for release.  These processors are by far the most widely made chips, as they are shipped by

Alchemy Au1000 MIPS Processor – Qualification Sample

the thousands to vendors, system builders/integrations, and even the media outlets for review.  The hope is that nothing major wrong is found with them, and that any bugs that are found can be dealt with in software or firmware, not requiring an entire silicon fix.  Intel continues to use Q-specs for these as well, leading to some confusion with the previously mentioned ES CPU’s.  AMD usually uses part numbers beginning with ‘Z’ for QS CPU’s and like Intel, does not offer these CPU’s for sale to the general public, they are either given to vendors, or sold exclusively to them for testing.   Motorola uses XC, or XPC for these, and unlike AMD/Intel, mass produces these and sells them, often for years, before they decide that a part/design is truly fully qualified/characterized (in which case the prefixe is changed to MC. or MPC).  Texas Instruments uses the ‘TMX” prefix for their Qual. Samples. and tended to make/sell them like Motorola did with theirs, changing the prefix to TMS for fully qualified production parts.

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Hitachi HD6801S0PJ – 1982 Automotive Spec 6801

The original Motorola MC6801 was released in 1977, built on a 5.1u NMOS process with 35,000 transistors (some sources say 25,000, which may be the ‘active’ transistor sites).  One of the very first customers was General Motors, you can read more about that in last years article on the 6801.  Hitachi was the primary second source for Motorola, primarily to supply the Japanese market, but they also competed with Motorola in the US market as well.  Hitachi released their version of the 6801 in 1980, with full production commencing in 1981.  It was made on a 3-micron NMOS process and was available in both a 1MHz speed (HD6801S0) and 1.25MHz (HD6801S5).  Around this time (1982) Hitachi was also transitioning their part numbering system.  Originally these parts were HD468xx… which was a bit confusing so they dropped the ‘4’.  For several years in the early 1980’s it is not uncommon to find parts with either, or both part numbers on them.

The pictured Hitachi HD6801S0P in interesting for a couple reasons.  The A00 denoted the ROM code for the 2K of onboard ROM.  A00 means that it is unprogrammed.  This would be useful for testing the 6801 with an external EPROM etc.  The ‘J’ on the package denotes that this device is a industrial/automotive spec part with an increased temperature range, in this case -40-85C.  Hitachi date codes are different from other manufacturers but are relatively simple.  The code 2E1 denotes the first week (1) of May (E) in 1982 (2).

Hitachi marked with both old and new part numbers
HD46800DP and HD6800P – dated 3F1 – First week of June 1983

*Years repeat, so 0 is used from 1980 and 1990
** ‘I’ is skipped to avoid confusion with the number ‘1’

What is perhaps more interesting is what came with this CPU when the museum got it.  Its often hard to figure out what a CPU/MCU was used in, or what it was for, its provenance.  This 6801 offers some help.  It came in an original Hitachi box, with a copy of a fax from Hitachi in Japan to the Hitachi sales office in the USA.  The fax denotes that these are qualification samples, automotive spec, and for a particular customer.  That customer is Chrysler (the automotive company now owned by Fiat).

Fax from Hitachi Japan stating use of the HD6801 samples

Also included on the fax is an original Japanese date stamp (June 1982 (Showa year 57)) .  These 6801s were fresh off the production line, having been made only a few weeks earlier.   The fax states these are for Chrysler in Huntsville, AL. with a reminder that they are “Not for Detroit” (where most of Chrysler production was.  That is an interesting addition, and important, as Chrysler did (it closed in 2011) have a very large presence in Huntsville, AL.  Huntsville is known as Rocket City, home of the Redstone Arsenal, where a large amount of US rocket, missile, and space engineering have taken place.  It was also the home of Chrysler Electronics (as well as most all of Chrysler’s military and space programs.  It was Chrysler who built the Saturn 1 and Saturn 1B upper stages for the NASA Apollo program.  Chrysler Electronics also built much of the Grown system electronics for the Apollo program as well as vehicle testing equipment for the M1 tank, the M2/3 Bradley and a host of other military programs.

Chrysler SERV – Space Shuttle Concept

Chrysler also proposed the Single-stage Earth-orbital Reusable Vehicle (SERV) during the design phase of what became the Shuttle program.

In the early 1970’s electronic use in cars was growing rapidly, leading Chrysler to greatly expand their presence in Huntsville.  These 6801s were likely for testing for cars, though it is unclear if Chrysler actually used the 6801 in their vehicles as ECUs from the mid-80’s all seem to be running the 6803 and 6805 MCUs.  Maybe if I find an early 80’s Chrysler I’ll tear out the ECU and find out.

SESCOSEM SFF96800K – Dated 7651 and made by Motorola

Sescosem was a French company that was formed during the merger of Thomson-Brandt and CSF in 1968.  Thomson-Brandt has its roots as a French subsidiary of GE back in 1892 as Compagnie Française Thomson-Houston (CFTH), while CSF was a French electronics company founded in 1918.  Thomson’s SESCO division (itself a joint venture between Thomson and General Electric) was merged with CSF’s COSEM division to form SESCOSEM.  SESCOSEM made many semiconductor products for the European market, starting with basic transistors and eventually second-sourcing microprocessors.

Sescosem SFF71708K – Mid 1978 – 2708 EPROM – Note the SESCOSEM logo

SESCOSEM began to work as a second-source for Motorola in September 1976.  Somewhat unusually SESCOSEM did not originally manufacture the IC’s they sold.  They received completed devices from Motorola, and remarked them as their own.  This may sound odd, but it served a purpose, it increased SESCOSEM’s market, and allowed Motorola to more easily sell their devices in Europe.  Buying local, to support the domestic industry, was, and continues to be important in Europe, so buying ‘Motorola’ devices, made in the US was less appealing then buying a ‘local’ chip, despite that chip simply being remarked. The agreement called for Motorola to supply
masks and information concerning the 6800 to Thomson-CSF (SESCOSEM parent) for present and future microprocessor products.  Eventually SESCOSEM was able to begin making their own devices at their 2 production facilities: Saint-Égrève , near Grenoble (COSEM site) and Aix-en-Provence (SESCO site).

Sescosem SFF71708J – Another 2708 but made in late 1979, note the switch to the Thomson Semiconductor logo

SESCOSEM also made/sold the various support products for the 6800 series, as well as several EPROM’s, including a clone of the 1702, 2708 and 2716. In mid-1979 SESCOSEM stopped using their own logo, and switched to that of Thomson and in 1982 SESCOSEM was rolled into Thomson Semiconductor, as the French government nationalized and consolidated many industries in an attempt to increase profitability.  Thomson Semiconductor also included Mostek (sold to Thomson in 1985), Silec,  Eurotechnique (French-National Semi joint venture) and EFCIS.  This allowed Thomson to produce Motorola designs, now including the 68000 series of processors. In 1987 SGS of Italy, merged with Thomson to form SGS-Thomson, what is now known today as STMicroelectronics.

While a bit convoluted, this is one reason so many companies manufactured Motorola products.  This helped contribute to the world-wide success of Motorola products.  No longer were they only a US product, but a global product, made and sold by global companies.  In a twist of irony, Freescale, the semiconductor portion of Motorola, was purchased by NXP Semiconductors of the Netherlands in 2015, adding yet another brand of 6800 and 68000 processors.  Only a year later however, in October of 2016 Qualcomm, one of the leading makers of cell-phone chipsets, announced that it will be purchasing NXP.  A Qualcomm 68k processor may very well be in our future.

Stratus XA/R (courtesy of the Computer History Museum)

Making the rounds this week is the Computer World story of a Stratus Tech. computer at a parts manufacturer in Michigan.  This computer has not had an unscheduled outage in 24-years, which seems rather impressive.  Originally installed in 1993 it has served well.  In 2010 it was awarded for being the longest serving Stratus computer, then being 17 years.  Phil Hogan, who originally installed the computer in 1993, and continues to maintain it to this day said in 2010  “Around Y2K, we thought it might be time to update the hardware, but we just didn’t get around to it”  In other words, if it’s not broke, don’t fix it.

Stratus computers are designed very similar to those used in space.  The two main difference are: 1) No need for radiation tolerant designs, let’s face it, if radiation tolerance becomes an issue in Michigan, there are things of greater importance than the server crashing and 2) hot swappable components.  Nearly everything on a Stratus is hot-swappable.  Straus servers of this type are based on an architecture they refer to as pair and spare.  Each logical processor is actually made from 4 physical CPU’s.  They are arranged in 2 sets of pairs.

Stratus G860 (XA/R) board diagram. Each board has 2 voting i860. (the pair) and each system has 2 boards (the spare).  The XP based systems were similar but had more cache and supported more CPUs.

Each pair executes the exact same code in lock-step.  CPU check logic checks the results from each, and if there is a discrepancy, if one CPU comes up with a different result than the other, the system immediately disables that pair and uses the remaining pair.  Since both pairs are working at the same time there is no fail-over time delay, it’s seamless and instant.  The technician can then pull the mis-behaving processor rack out and replace it, while the system is running.  Memory, power supplies, etc all work in similar fashion.

These systems typically are used in areas where downtime is absolutely unacceptable, banking, credit card processing, and other operations are typical.  The exact server in this case is a Stratus XA/R 10.  This was Stratus’s gap filler.  Since their creation in the early 1980’s their servers had been based on Motorola 68k processors, but in the late 1980’s they decided to move to a RISC architecture and chose HP’s PA-RISC.  There was a small problem with this, it wasn’t ready, so Stratus developed the XA line to fill in the several years gap it would take. The first XA/R systems became available in early 1991 and cost from $145,000 to over $1 million.

Intel A80860XR-33 – 33MHz as used in the XA/R systems. Could be upgraded to an XP.

The XA is based on another RISC processor, the Intel i860XR/XP.  Initial systems were based on 32MHz i860XR processors.  The 860XR has 4K of I-cache and 8K of D-cache and typically ran at 33MHz.  Stratus speed rating may be based on the effective speed after the CPU check logic is applied or they have downclocked it slightly for reliability. XA/R systems were based on the second generation i860XP.  The 860XP ran at 48MHz and had increased cache size (16K/16K) and had some other enhancements as well.  These servers continued to be made until the Continuum Product Line (Using Hewlett Packard “PA-RISC” architecture) was released in March of 1995.

This type of redundancy is largely a thing of the past, at least for commercial systems.  The use of the cloud for server farms made of hundreds, thousands, and often more computers that are transparent to the user has achieved much the same goal, providing one’s connection to the cloud is also redundant.  Mainframes  and supercomputers are designed for fault tolerance, but most of it is now handled in software, rather than pure hardware.

Motorola XC6801L – Early White ceramic package from early 1979. XC denotes a not fully qualified part.

A microcontroller (or microcomputer) is a CPU, with additional on-board peripherals, usually containing RAM, ROM, and I/O as to serve as a single (or close to single) chip solution for a computer system.  As the program space is typically small, they were designed and used for high volume, low cost, simple applications.  Today we would refer to them as embedded applications.  The Motorola MC6800, released in 1974 was a decent 8-bit processor.  It was however not inexpensive (a fact not lost upon one of its designers, Chuck Peddle, who left to design the 6502).  Initial pricing for the MC6800 was $360, dropping to $175 the next year.

For embedded use, prices needs to be in the few dollars range, with as little chips as possible required for a design.  By 1977 Motorola had a solution, the MC6802.  This MC6802 was an enhanced MC6800 128-bytes of RAM and an on-board clock-generator.  When combined with the MC6846 (which provided ROM, I/O and Timers) a complete system could be built.  Defective MC6802s were often sold as RAM-less MC6808s.

Motorola MC6802L – Dated March of 1978. The 6802 had 64-bytes of RAM and no ROM.

The MC6802 was followed by the more complex MC6801, which integrates the features of the MC6846 on die, making a true 8-bit single chip microcomputer.  Most sources refer to the MC6801 being released in 1978, however it was actually released in 1977, likely at the same time, or similar as the MC6802.  US Patent Application US4156867 filed on September 9th of 1977 references both processors.  GM was to be the lead customer for the MC6801, it was the MCU of choice for the digital trip meter (TripMaster) of the 1978 Cadillac Seville.  The 1978 Seville began production on September 29, 1977 using a 6801 made on a 5.1um NMOS process.  It is likely that all of the first production of the 6801 was reserved for GM, and it wasn’t until 1978 and later that Motorola began to market it (it begins to show up in Motorola marketing only in 1979).  In 1979 the MC6801 also switched to a 3.9um HMOS process, which likely increased yields and decreased costs.  The TripMaster was a $920 factory option that proved to be rather unpopular, likely due to it adding nearly $1000 in cost to a $14,000 car.

Motorola MC68701U4L-1 1987 6801 with upgraded RAM/ROM and Timers

This lack of early availability, coupled with the fact that while capable, the 35,000 transistor 6801 wasn’t particularly inexpensive led it to have very little success in the market.  The EPROM version, the MC68701 in fact is much more common, likely due to the fact that it was used in lower volume products, where cost wasn’t such an issue.  In 1979 Motorola attempted to remedy this by releasing the MC6805 series.  This was designed from the ground up to be low cost.  The first versions had half the ROM and half the RAM as the 6801, while keeping the I/O.  They were also available in CMOS (as the MC146805).  They were inexpensive, and highly functional, and were widely used.  The 6805 continues to see use today as the 68HC05 and 68HC08 series.

Motorola XC68HC11A0FN – 1987 – Preproduction, Enhanced 6801

The MC6801 was not, however, done.  By this time manufacturing had improved, allowing costs to be lower.  Motorola released an upgraded 6801, the MC6801U4 which expanded the timer functions, increased the ROM to 4K, and increased the RAM to 192-bytes.   In 1985 the MC6801 was upgraded again, a second 16-bit index register was added, as well as true bit-manipulation instructions.  The Motorola MC68HC11, the name change reflecting the greatly enhanced core, was made in many varieties with different sizes of RAM, ROM, and EEPROM. The MC68HC11A8 was also the first MCU to integrate EEPROM on die, in this case, 512 bytes worth.  The MC68HC11 series, and its 68HC12 and 16 successors, continue to be made, and used today, ironically, frequently in automotive applications, where the original MC6801 failed to be as great of success as Motorola dreamed of..  GM took the 6801 design and under license from Motorola, extensively modified it (along with the 6803), using external RAM and ROM, and less of the integrated peripherals, and used this custom version for their ECUs.  Some later 1980s cars used a Hitachi HD6801 version for their ECU (such as Subaru).

Motorola MHTL – Almost the entire product line is shown. Made from 1967-1972

Before the single chip processor, the Intel 4004, TI TMS1000, or Four Phase AL-1 (depending on your school of thought) ‘processing’ was done by discrete logic.  These are SSI IC’s (Small Scale Integration), a step up from literal discrete transistors, each IC contains 2-30 transistors, implementing a couple gates.

The most famous of these is the TTL (Transistor-Transistor Logic) series developed by Sylvania in 1963.  Before TTL though their was RTL (Resistor-Transistor Logic) in 1961 and the next year, DTL (Diode-Transistor Logic), whereby Diodes were added to the inputs, allowing much better fan-in.  Neither of these designs had great noise immunity, which in many applications was very important.  Motorola patented a modification to DTL in 1966 with production of the new MHTL family commencing in 1967-1968.

MHTL, Motorola High Threshold Logic, was designed for environments where high noise immunity was a must.  Noise, really any voltage that is present, and not wanted/not an actual signal, can be complicated to deal with.  Motorola’s solution was to make the signal much larger, this s clearly the ‘bigger hammer’ approach to noise.  Normal DTL has a turn on voltage of 1.5V (0-5V Logic). fairly low, and in an industrial environment, where these IC’s may be controlling large motors and solenoids, a common noise voltage.  MHTL raised that to 7.5V, requiring a 15V supply.  Speed suffers greatly, as the voltage must now swing from 0-15V for a logic 0 to a logic 1 on the outputs, 3MHz being a typical max compared to 40MHz for Motorola’s DTL.  It should be noted, that as fast as that sounds, it’s only for a few gates, a full board of these will not be able to attain anything close to 3MHz due to propagation delays through the many IC’s.

The pictured MHTL devices are:

Today, noise immunity is still relevant, and much much more complex than simply increasing the supply voltage.  Higher supply voltages not only slow down switching, but they also increase power draw significantly. The MC660 pictured has exactly 2 gates (4-input NAND), consisting of 6 transistors, and still dissipates 88mW. That would be the equivalent of an Intel 4004 dissipating 12 Watts, or an Intel 386 needing about 4 Kilowatts. Modern noise immunity is handled by adding additional transistors (keepers, pre-chargers, etc) that can keep gates from being affected by noise, whether it’s from power/ground lines, leakages, or other reasons.  This allows chips with millions of transistors to operate at sub 1 Volt levels.  An impressive feat.

1985 production 68020 ‘XC’ denotes a not fully qualified device.

In 1979 Motorola wow’d the world with the introduction of the MC68000 MACSS (Motorola Advanced Computer System on Silicon).  One of the first single chip 32-bit processors.  In 1982 the design was upgraded and revised, and released as the 68010.  Performance wasn’t that much better then the original 68k so it saw much smaller adoption.

In 1984 Motorola continued the 68k line with the 68020.  Speed was greatly improved, up to 33MHz.  It was originally made on a 2 micron HCMOS process, allowing the design to use 200,000 transistors and integrate additional addressing modes, co-processor support, and multi-processor support.

The Swedish Computer archeology blog Ehliar has a nice article and die shots on its architecture and design.  Check it out.